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Hirokazu Noma Engineer, Packaging Design Methodology, Technology Service Development IBM Engineering & Technology Services, IBM Japan, Ltd. Tohru Nakanishi
Hirokazu Noma, Yukifumi Oyama, Hidetoshi Nishiwaki, Masahide Takami, Toshiyuki Takatani, Kazushige Toriyama and Yasumitsu Orii: Release Date: April 23, 2010
... Takashi ATSUMI, Mikio SHIRAI, Ikuo OHNUMA and Kiyohito ISHIDA 79 Wettability and Reliability for Double-Sided Assembly with Chip Connection (C2) Flip-Chip Technology／ Hirokazu NOMA, ...
Hiroshi Fujioka, Hirokazu Noma, Kanta Ono and Masaharu Oshima 4660-4662 : Comparison of Breakdown Behavior in Electron-Irradiated and Proton-Irradiated Silicon pn Junctions
Effect of Impurity at SiO 2 /Si Interface on 2D Hole Gas: Hiroshi Fujioka, Hirokazu Noma, Kanta Ono and Masaharu Oshima: Release Date: 20010629 ...
Hirokazu Noma, Yukifumi Oyama, Hidetoshi Nishiwaki, Masahide Takami, Toshiyuki Takatani, Kazushige Toriyama and Yasumitsu Orii: Release Date: April 23, 2010
... Mikio SHIRAI, Ikuo OHNUMA and Kiyohito ISHIDA 79 Wettability and Reliability for Double-Sided Assembly with Chip Connection (C2) Flip-Chip Technology／ Hirokazu NOMA, ...
Hiroshi Fujioka, Hirokazu Noma, Kanta Ono and Masaharu Oshima 4660-4662 : Comparison of Breakdown Behavior in Electron-Irradiated and Proton-Irradiated Silicon pn ...
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