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... of Materials Physics and Chemistry University of Science and Technology Beijing) Title: Stress corrosion cracking and crack healing in materials Prof.Hongwei Gu Prof.Hongwei Gu (BijiG lR ...
Wo ng, Hongwei Gu, Bing Xu, and Matthew M. F. Yuen Abstract— Copper-epoxy molding compound (Cu-EMC) interf ace is known to be one of the weakest interfaces in an electronic ...
Yan ZHANG, Zhimou YANG, Fang YUAN, Hongwei GU, Ping GAO, Bing XU (2004) "Molecular Recognition Remodes the Self-Assembly of Hydrogelators and Increases the Elasticity of the ...
Prof. Hongwei Gu ( Beijing General Research Institute for Nonferrous Metals ) Study of 10-m Length YBCO Superconducting Tape: Abstract
Self-assembled multivalent vancomycin on cell surfaces against vancomycin-resistant enterococci (VRE) † Bengang Xing, a Pak Leung Ho, b Chun-Wing Yu, a Kin-Hung Chow, b Hongwei Gu a and Bing ...
E-mail: Hongwei.Gu@ALL-T.com . Reducing the composites fabrication cost with the Peel Ply and Vacuum Infusion Media Made In China from All-T ...
College of Chemistry, Chemical Engineering and Materials Science
... Materials Physics and Chemistry University of Science and Technology Beijing) Title: Stress corrosion cracking and crack healing in materials Prof.Hongwei Gu Prof.Hongwei Gu ...
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