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... Packaging Technologies ULVAC TECHNICAL JOURNAL (ENGLISH No.70E 2009 Development of Ashing Processes for Packaging Processes Takashi Kurimoto*, Masahisa Ueda* and Koukou Suu*
Yutaka Kokaze, Isao Kimura, Mitsuhiro Endo, Masahisa Ueda, Shin Kikuchi, Yutaka Nishioka, and Koukou Suu. Institute for Semiconductor Technologies, ULVAC, Inc., 1220-1 Suyama ...
"It may serve as a power source for electric vehicles if we can make it larger," said Koukou Suu, general manager of the Institute for Semiconductor Technologies of Ulvac.
Fumiyoshi Takano, Hisashi Shima, Hidenobu Muramatsu, Yutaka Kokaze 1, Yutaka Nishioka 1, Koukou Suu 1, Hirofumi Kishi 2, Nelson Buntimil Arboleda, Jr. 2, Melanie David 2, ...
ferroelectric thin films Koukou SUU, Yutaka NISHIOKA, Akira OSAWA and Noriaki TANI Preparation and properties of nitride thin films Osamu TAKAI
... Packaging Technologies ULVAC TECHNICAL JOURNAL (ENGLISH No.70E 2009 Development of Ashing Processes for Packaging Processes Takashi Kurimoto*, Masahisa Ueda* and Koukou Suu*
Yutaka Kokaze, Isao Kimura, Mitsuhiro Endo, Masahisa Ueda, Shin Kikuchi, Yutaka Nishioka, and Koukou Suu. Institute for Semiconductor Technologies, ULVAC, Inc., 1220 ...
"It may serve as a power source for electric vehicles if we can make it larger," said Koukou Suu, general manager of the Institute for Semiconductor Technologies of Ulvac.
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