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Inst.of Semiconductor and Electronics Tech. *Murayama Takahide 1,Morikawa Yasuhiro 1,Yoshii Manabu 1,Suu Koukou 1: 2: TSV etching process using by VHF-CCP.
ULVAC.Inst.Semi.tech. 1 *Murayama Takahide 1,Morikawa Yasuhiro 1,Suu koukou 1 4: Silicon Etching using Atmospheric Pressure Surface Discharge
ULVAC,Inc. Murayama Takahide 1,Kawasaki Kenichirou 1,Morikawa Yasuhiro 1,Suu Koukou1 : 7: Frequency dependence of Silicon Etching by the RF Surface Plasma
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