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Original Paper(Vol.56 No.2 pp.129-135) Creep and Creep Rupture Properties of Sn-8Zn-3Bi Solder. Akio TAKADA, Masao SAKANE and Yutaka TSUKADA. Abstract: This paper studies creep and ...
Original Paper(Vol.58 No.2 pp.155-161) Low Cycle Fatigue Lives of Sn-37Pb and Sn-3.5Ag Solders at Low Temperatures. Noritake HIYOSHI, Akihisa KATOH, Masao SAKANE and Yutaka TSUKADA
Shigeru Nakagawa, Yoichi Taira, Hidetoshi Numata, Kaoru Kobayashi*, Kenji Terada* and Yutaka Tsukada*, IBM Tokyo Research Laboratory, Kyocera
Tetsuro OBARA, Yutaka TSUKADA, Jayan Sentanuhady and Shigeharu OHYAGI . 7. Molecular Dynamics Study on Ultra-Thin Liquid Film Sheared between Solid Surfaces (Influence of the Crystal ...
Joint Reliability and Plating Technology in Semiconductor Packaging: 112: Yutaka TSUKADA: Release Date: October 8, 2004 [Image PDF (1618K)]
Original Paper(Vol.56 No.2 pp.129-135) Creep and Creep Rupture Properties of Sn-8Zn-3Bi Solder. Akio TAKADA, Masao SAKANE and Yutaka TSUKADA. Abstract: This paper studies ...
Noritake HIYOSHI, Akihisa KATOH, Masao SAKANE and Yutaka TSUKADA. Abstract: This paper describes low cycle fatigue lives of Sn-37Pb and Sn-3.5Ag solders at low temperatures.
Joint Reliability and Plating Technology in Semiconductor Packaging: 112: Yutaka TSUKADA: Release Date: October 8, 2004 [Image PDF (1618K)]
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