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ADACHI Masaki KITAJIMA Tomokazu OBARA Shoji MIYAKO Hiroyuki Most semiconductor packages are made of epoxy resin, a thermoset compound material.
Satoshi NAGANO: IN: Takatoshi MATSUMOTO [Cautions] 27' Yusuke TANAKA [Cautions] 36' ADIEL: 49' Tomokazu NAGIRA: 73' Koji SAKAMOTO: 56' LINCOLN: 80' Yoshio KITAJIMA
Hideaki Kitajima (J2001 S2 #238) Tomokazu Myojin (J2001 S2 #236) (J2003 #49 at 27/05/2003) (J2003 National team #29.J2005 #48.Thanks to Mr. K.S.)
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IID, Inc. (Consumer Services industry): "Response."(http://response.jp/) ; One of Largest Automotive News Website in Japan,, (October 2006-Present)