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Coupled Thermal-Stress Analysis for FC-BGA Packaging Reliability Design. Kenji Hirohata, Katsumi Hisano, Minoru Mukai, Hideo Aoki, Chiaki Takubo, Takashi Kawakami, Michael Pecht
Kenji Hirohata(Toshiba Corporation) Structual Reliability Design for High Density Packaging of Electronic Devices. Hiroyuki Waki(Osaka Univ.)
Kenji HIROHATA (Toshiba Corporation) Masatoshi WATANABE (Hitachi, Ltd.) Kenji AMAYA (Tokyo Institute of Technology) Yoshiyuki TOYODA (Central Research Institute of Electric Power ...
Kenji Hirohata, Katsumi Hisano, Minoru Mukai, Hideo Aoki, Chiaki Takubo, Takashi Kawakami, Michael Pecht, “Coupled Thermal-Stress Analysis for FC-BGA Packaging Reliability Design ...
Dr, Kenji Hirohata (Toshiba) Session 2 Dr. Klaus Pressel (Infineon Technologies) Session 6 Dr. Yutaka Uematsu (Hitachi) Session 4 Dr. Kiju Lee (Osaka University)
Coupled Thermal-Stress Analysis for FC-BGA Packaging Reliability Design. Kenji Hirohata, Katsumi Hisano, Minoru Mukai, Hideo Aoki, Chiaki Takubo, Takashi Kawakami, Michael ...
Kenji Hirohata(Toshiba Corporation) Structual Reliability Design for High Density Packaging of Electronic Devices. Hiroyuki Waki(Osaka Univ.)
Kenji HIROHATA (Toshiba Corporation) Masatoshi WATANABE (Hitachi, Ltd.) Kenji AMAYA (Tokyo Institute of Technology) Yoshiyuki TOYODA (Central Research Institute of Electric ...
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