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KHAN Navas, Institute of Microelectronics Committee Members CHONG Chin Hui, Micron Semiconductor Asia HO Hong Meng, Singapore LEE Teck Kheng, Institute of Technical Education
Khan Navas, Institute of Microelectronics, Singapore Martin OPPERMANN, Technische Universitat Dresden, Germany Gaurav SHARMA, Institute of Microelectronics, Singapore
... 03:00 - 03:30 pm TSV Etching, Deposition and Plating Ranganathan Nagarajan and Ebin Liao IME 03:30 - 04:00 pm Tea Break 04:00 - 04:30 pm TSV Wafer Thinning and Handling Khan Navas and ...
... Yogendra JOSHI, Georgia Institute of Technology, USA Sung Jin KIM, KAIST, Korea Baomin LIU, Advanced Micro Devices, USA Wataru NAKAYAMA, Therm Tech International, Japan Khan NAVAS, ...
... Yogendra JOSHI, Georgia Institute of Technology, USA Sung Jin KIM, KAIST, Korea Baomin LIU, Advanced Micro Devices, USA Wataru NAKAYAMA, Therm Tech International, Japan Khan NAVAS, ...
KHAN Navas, Institute of Microelectronics Committee Members CHONG Chin Hui, Micron Semiconductor Asia HO Hong Meng, Singapore LEE Teck Kheng, Institute of Technical Education
Khan Navas, Institute of Microelectronics, Singapore Martin OPPERMANN, Technische Universitat Dresden, Germany Gaurav SHARMA, Institute of Microelectronics, Singapore
KHAN Navas, IME, A*STAR Finance Chair ANAND Ashok, Advanced Micro Devices Facilities Chair YEO Alfred, Global Foundries Sponsorship & Exhibition Chair
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