Kinya Ichikawa

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Locality:: Japan
Summary:: Assembly Technology Development Japan Manager at Intel K.K.
Experience:: Intel K.K. (Semiconductors industry): Assembly Technology Development Japan Manager, (-)

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Worldwide Citation : DEBENDRA MALLIK { }

An integrated circuit package which has internal bonding pads that are located on ... Debendra Mallik Kinya Ichikawa; Terry L Sterrett; Johanna Swan 2008-03-18

Committee

Kinya Ichikawa (Intel) Inoue Masahiro (Osaka University) Hirotaka Ueda (Semi Consult) Fumio Uchikoba (Nihon University) Dongdong Wang (Ibiden USA)

VLSI Packaging Workshop in Japan

Risto Tuominen and Petteri Palm, Imbera Electronics Oy 6.5. Multi-Chip / Multi-Package Stacked Packaging Technology Jiro Kubota, Seiichiro Seki, and Kinya Ichikawa, Intel K.K.

Committee

Kinya Ichikawa (Intel) Inoue Masahiro (Osaka University) Hirotaka Ueda (Semi Consult) Fumio Uchikoba (Nihon University) Dongdong Wang (Ibiden USA)

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