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R. Durairaj, Lam Wai Man, S. Mallik, and N.N.Ekere (2009) Thixotropic Studies of Lead-based Solder, Lead-free Solder and Conductive Adhesive Pastes, The 11 th ...
R. Durairaj, Lam Wai Man, and S. Ramesh, "Rheological Characterisation and Empirical Modelling of Lead-Free Solder Pastes and Isotropic Conductive Adhesive ...
3.S.Ramesh, Chiam-Wen Liew, Ezra Morris, R.Durairaj, Effect of PVC on ionic conductivity, crystallographic structural, morphological and thermal characterizations in PMMA ...
... of water by dielectric barrier discharge D. P. Subedi, R. B. Tyata, A. Khadgi and C. S. Wong 117 Structural breakdown and build-up in Sn/Ag/Cu paste suspensions R. Durairaj and ...
Sabuj MALLIK, *Jens THIEME, *Reinhard BAUER, Ndy N. EKERE, A. SEMAN, R. BHATTI, **R. DURAIRAJ University of Greenwich *University of Applied Sciences
R. Durairaj, Lam Wai Man, S. Mallik, and N.N.Ekere (2009) Thixotropic Studies of Lead-based Solder, Lead-free Solder and Conductive Adhesive Pastes, The 11 th ...
R. Durairaj, Lam Wai Man, and S. Ramesh, "Rheological Characterisation and Empirical Modelling of Lead-Free Solder Pastes and Isotropic Conductive ...
R. Durairaj and Lam Wai Man (2009) Investigation of the thixotorpic behavior of solder pastes and isotropic conductive adhesives used in the assembly of high ...
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