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Takahiro OKADA, Seiji ISHIYAMA, Hideki SEZUTSU, Akihiro USAMI, Toshiki TAMURA, Kazuei MITA, Kazuhito FUJIYAMA and Tatsuji SEKI: Advance Publication Date: 2007/07/07
Kenji Murakami, Akihiro Uchiyama, Takehiro Kokuho, Yasuyuki Mori, Hiroshi Sentsui, Takashi Yada, Masatoshi Tanigawa, Akira Kuwano, Hidekazu Nagaya, Seiji Ishiyama, Hiroshi Kaki ...
Inventor: Kazuo Ogata Tsuyoshi Fukuo; Seiji Ishiyama; Tetsuhide Koh Assignee: Intel Corporation Attorney: David L Guglielmi Title: Flexible joint methodology to attach a die on an ...
Inventor: Kazuo Ogata; Tsuyoshi Fukuo; Seiji Ishiyama; Tetsuhide Koh Assignee: Intel Corporation Attorney: null David L Guglielmi Title: Flexible joint methodology to attach a die on ...
/ Tsuyoshi Nomura, Masahiro Ikeda, Seiji Ishiyama, Kazuhide Mita, Toshiki Tamura, Takahiro Okada, Kazuhito Fujiyama, and Akihiro Usami p. 386-391
Takahiro OKADA, Seiji ISHIYAMA, Hideki SEZUTSU, Akihiro USAMI, Toshiki TAMURA, Kazuei MITA, Kazuhito FUJIYAMA and Tatsuji SEKI: Advance Publication Date: 2007/07/07
Kenji Murakami, Akihiro Uchiyama, Takehiro Kokuho, Yasuyuki Mori, Hiroshi Sentsui, Takashi Yada, Masatoshi Tanigawa, Akira Kuwano, Hidekazu Nagaya, Seiji Ishiyama ...
/ Tsuyoshi Nomura, Masahiro Ikeda, Seiji Ishiyama, Kazuhide Mita, Toshiki Tamura, Takahiro Okada, Kazuhito Fujiyama, and Akihiro Usami p. 386-391
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Intel (Public Company; 10,001 or more employees; INTC; Semiconductors industry): Senior Material Engineer, (1984-2010)