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- Hong Shouyu, Copper Wire Bonding
... distributions of ACF interconnections for flip-chip-on-flex (COF) applications S H Su, K Zhao, S W Ma, J H Zhang Experimental Research of Copper Wire Ball Bonding Hong Shouyu ...
Shigeki Sakai Mitsue Takahashi Li Qiu-Hong Wang Shouyu Takeshi Horiuchi Nanoelectronics Research Institute
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