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For industry collaboration: Dr Spencer Chew, Deputy Group Manager (Industry), Forming Technology Group, Email: ycchew@SIMTech.a-star.edu.sg
I went to Kinabalu on three occasions, the first in 1980, a second trip in 1985 and the third time in 2000. This summit picture was from the first trip organised by Spencer Chew.
Spencer CHEW, Cookson Semiconductor Packaging Materials Desmond CHONG, United Test and Assembly Center Ltd
... of Viscoelastic Behaviour of a Molding Compound with Application to Delamination Analysis in IC Packages Gojun Hu 1, 2, Andrew A. O. Tay 2, Yongwei Zhang 3, Wenhui Zhu 4 and Spencer Chew 1 ...
Spencer Chew, Cookson Semiconductor Packaging Materials : ELECTRICAL MODELING AND SIGNAL INTEGRITY Mahadevan K. Iyer, Institute of ...
For industry collaboration: Dr Spencer Chew, Deputy Group Manager (Industry), Forming Technology Group, Email: ycchew@SIMTech.a-star.edu.sg
This summit picture was from the first trip organised by Spencer Chew. It was my first mountain climbing trip. I recall being very excited about the trip and trained very ...
... Behaviour of a Molding Compound with Application to Delamination Analysis in IC Packages Gojun Hu 1, 2, Andrew A. O. Tay 2, Yongwei Zhang 3, Wenhui Zhu 4 and Spencer Chew 1 1 ...
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