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Jenn-Ming Song, Chien-Wei Su, Yi-Shao Lai, Ying-Ta Chiu: Page: 629-632 : Article: Materials Communications: Formation Of Metal Microspheres By Ultrasonic Cavitation
Yi-Shao Lai , ASE, Taiwan. Tong Yan Tee , Amkor, Singapore. 1230 - 1330 Short Course Luncheon at Galleria II & III, Level 3 Paradiso, Level 3 Cardinal, Level 3 Swallow, Level 3 Falcon ...
6 Next-Generation Electronic Packaging: Trend and Materials Challenges Yi-Shao Lai (ASE/Taiwan) Convergence in handheld electronic devices has drivenincredible changes and adoption of ...
University of Maryland, USA Xuejun FAN, Lamar University, USA Yi-Shao LAI, ASE, Taiwan Tinyu Leon LIN, Motorola Keith NEWMAN, Sun Microsystems, USA Young-Bae PARK, Andong National ...
Po-Ying Chen, Heng-Yu Kung, Yi-Shao Lai, Ming Hsiung Tsai, and Wen-Kuan Yeh Published February 15, 2008 [Full Text PDF (211K)] [Buy This Article]
View Yi-Shao Lai's professional profile. Publications: 42 | Citations: 22 | G-Index: 3 | H-Index: 3. Interest: Algorithms & Theory
... are conducted to measure package warpage and compared to the simulation results. Advisory Committee: Shi-Pin Ho - committee member; Tei-Chen Chen - committee member; Yi-Shao Lai ...
Yi-Shao Lai ASE Group, Taiwan Finite element analysis of solder joints under current stressing: methodologies and reliability prediction
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National Sun Yat-sen University (Educational Institution; Research industry): Adjunct A...
IEEE (Non-Profit; Non-Profit Organization Management industry): Guest Editor, IEEE Transactions on Components and ...