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Package and Board Level Reliability Ahmer SYED, Amkor Abstract: Part I - Accelerated Testing and Design for Reliability Both qualification and reliability testing employ accelerated ...
Ahmer SYED, Amkor: Title: Package and Board Level Reliability Part 1-Accelerated Testing and Design for Reliability : Short Course SC2: Speaker: Eric PERFECTO, IBM
... Board Level Assembly and Reliability Considerations for QFN Type Packages” By Ahmer Syed and ...
“Reliability of Lead-Free Solder Connections for Area-Array Packages” by Ahmer Syed, Amkor Technology, Inc 6. “Accumulated Creep Strain and Energy Density Based Thermal Fatigue ...
Gillani Ahmer Syed, BBA. Gillani Faizan Haider Syed, BBA. Gillani Jehanzeb, MBA. Gondal Khan Bahadur, BBA. Gul Neelam, BSc. Gundra M. Fahad, BBA. Habib Akhyar S. M., BBA
Package and Board Level Reliability Ahmer SYED, Amkor Abstract: Part I - Accelerated Testing and Design for Reliability Both qualification and reliability testing employ ...
Ahmer SYED, Amkor: Title: Package and Board Level Reliability Part 1-Accelerated Testing and Design for Reliability : Short Course SC2: Speaker: Eric PERFECTO, IBM
Factors Affecting Electromigration and Current Carrying Capacity of FC and 3D IC Interconnects: by Ahmer SYED, Amkor Technology, United States
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