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588-595: Yasumitsu Orii, Katsuyuki Sakuma, Keiji Matsumoto and Kazushige Toriyama: Release Date: September 3, 2010 [PDF (2536K)]
Prospective Flip Chip Assembly Technology in Semiconductor Package: 292-300: Mitsuya Ishida, Yasumitsu Orii, Katsuyuki Sakuma and Fumiaki Yamada: Release Date: June 25, 2010
Takuji Matsumoto, Masakazu Satoh, Katsuyuki Sakuma, Hiroyuki Kurino, Nobuaki Miyakawa 1, Hikotaro Itani 2 and Mitsumasa Koyanagi. Department of Machine Intelligence and System ...
Noriyasu Nagai, Hiroshi Ono, Katsuyuki Sakuma, Mikiko Saito, Jun Mizuno, and Shuichi Shoji. Major in Nano-Science and Nano-Engineering, Waseda University, Shinjuku, Tokyo 169 ...
Vacuum Ultraviolet Surface Treatment for Cu/Sn Micro-bumps Katsuyuki Sakuma*1,2, Naoko Unami*1, and Jun Mizuno*1,1 Waseda University, 2 IBM Research - Tokyo
588-595: Yasumitsu Orii, Katsuyuki Sakuma, Keiji Matsumoto and Kazushige Toriyama: Release Date: September 3, 2010 [PDF (2536K)]
Prospective Flip Chip Assembly Technology in Semiconductor Package: 292-300: Mitsuya Ishida, Yasumitsu Orii, Katsuyuki Sakuma and Fumiaki Yamada: Release Date: June 25, 2010
Takuji Matsumoto, Masakazu Satoh, Katsuyuki Sakuma, Hiroyuki Kurino, Nobuaki Miyakawa 1, Hikotaro Itani 2 and Mitsumasa Koyanagi. Department of Machine Intelligence ...
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