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Solder Ball Attachment Assessment of Reballed Plastic Ball Grid Array Packages. Lei Nie, Michael Osterman, Michael Pecht, Fubin Song, Jeffery Lo and S. W. Ricky Lee
Microstructural Analysis of Reworked Ball Grid Array Assemblies Under Thermomechanical Loading Conditions. Lei Nie, Michael Osterman, Michael Pecht
Genre: Romance Starring: Karena Lam, Leo Ku, Huang Xiaoming, Lu Yi, Naoki Hosaka, Alec Su, Fan Wei, Deng Chao, Tong Dawei, Zhang Junning, Huang Lei, Nie Yuan
/ Zhang, Lei. / Nie, Qingjuan. / Xian, Mo. (Page 1 - 5) Cost determination of the electro-mechanical equipment of a small hydro-power plant Ogayar, B. / Vidal, P G.
The 2008 Charles Hutchins Educational Grant recipient, Lei Nie, a graduate student in the field of Mechanical Engineering at the University of Maryland, has been selected by the ...
Solder Ball Attachment Assessment of Reballed Plastic Ball Grid Array Packages. Lei Nie, Michael Osterman, Michael Pecht, Fubin Song, Jeffery Lo and S. W. Ricky Lee
Microstructural Analysis of Reworked Ball Grid Array Assemblies Under Thermomechanical Loading Conditions. Lei Nie, Michael Osterman, Michael Pecht
Interfacial Reaction of Reballed BGAs under Isothermal Aging Conditions. Lei Nie, Mingzhi Dong, Jian Cai, Michael Osterman and Michael Pecht. Abstract: Reballing involves ...
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