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Xu LH, Pang JHL, Tu KN: Effect of electromigration-induced back stress gradient on nanoindentation marker movement in SnAgCu solder joints, APPLIED PHYSICS LETTERS Volume: 89 ...
Xu LH, Pang JHL, Che FX. (2008). Impact of thermal cycling on Sn-Ag-Cu solder joints and board-level drop reliability. Journal of Electronic Materials, 37 (6), 880-886.
Xu LH, Pang JHL, Tu KN: Effect of electromigration-induced back stress gradient on nanoindentation marker movement in SnAgCu solder joints, APPLIED PHYSICS LETTERS ...
Xu LH, Pang JHL, Che FX. (2008). Impact of thermal cycling on Sn-Ag-Cu solder joints and board-level drop reliability. Journal of Electronic Materials, 37 (6), 880-886.
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