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Noboru SEKINO. Abstract: To improve mechanical properties and dimensional stabilities of low-density particleboards, a new mat forming and pressing technique was applied.
Noboru SEKINO, Masafumi INOUE and Hidefumi YAMAUCHI. Abstract: Mechanical properties of particleboards such as surface hardness, modulus of elasticity (MOE), bending strength (MOR ...
... wood processing residues and wastes II: Effect of chip thickness and panel density on the thermal conductivity and resistance against falling impact Yoshihiro Kawamura, Noboru Sekino ...
In-plane dimensional stability of wood-basedpanel products III: Constraint of linearexpansion by nail-joint with or without bonding Noboru Sekino, Atsuhiko Suematsu : Mokuzai ...
Noboru Sekino, Go Yamauchi Binder-less wood chip insulation panel for building use made from wood processing residues and wastes V: Thermal conductivity and drop impact resistance ...
Noboru SEKINO. Abstract: To improve mechanical properties and dimensional stabilities of low-density particleboards, a new mat forming and pressing technique was applied.
Noboru SEKINO, Masafumi INOUE and Hidefumi YAMAUCHI. Abstract: Mechanical properties of particleboards such as surface hardness, modulus of elasticity (MOE), bending ...
Noboru SEKINO and Taeko SASAKI. Abstract: When wood based panels are nailed and/or bonded to lumber frame, effects of mechanical restraint on the panel hygroscopic linear ...
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