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Fundamental Performance of MCF (Magnetic Compound Fluid) Polishing Tool on Thinning Process of Quartz Wafer: 221-226: Yongbo WU, Kenji TEZUKA, Kunio SHIMADA and Keita YAMAMOTO
- Polishing characteristics under different applying methods of magnetic field - E46 *Taketoshi Furuya, Yongbo Wu, Mituyoshi Nomura, Kunio Shimada, Keita Yamamoto and Weimin Lin
Yufeng FAN, Yongbo WU, Masana KATO, Toru TACHIBANA, Katsuo SYOJI and Tsunemoto KURIYAGAWA. 52 Evaluation of Grinding Wheel Surface by Means of Grinding Sound Discrimination
Yongbo Wu, Akita Prefectural University, Japan . 3:40 PM-4:05 PM Force Modelling in Profiled Surface Grinding. Viktoria Bana, Philips Domestic Appliances ...
TIME. EVENT. VENUE. 08.30 – 10.30. Parallel Technical Session IV. BALLROOM 1, 2, 3, ENGGANG, MERAK, HELANG, RAJAWALI. 10.30 - 10.45. Tea Break. FOYER. 10.45 - 11.25
Fundamental Performance of MCF (Magnetic Compound Fluid) Polishing Tool on Thinning Process of Quartz Wafer: 221-226: Yongbo WU, Kenji TEZUKA, Kunio SHIMADA and Keita YAMAMOTO
- Polishing characteristics under different applying methods of magnetic field - E46 *Taketoshi Furuya, Yongbo Wu, Mituyoshi Nomura, Kunio Shimada, Keita Yamamoto and Weimin ...
Treatment of Silicon Wafer Edge by Ultrasonically Assisted Polishing-1st Report: Construction of experimental apparatus and polishing tests: J25 *Naoki Kobayashi, Yongbo Wu ...
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